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New AIM V9 No Clean solder paste is formulated for near-zero voiding on BGA
The Techspray 1823-5F No-Clean Desoldering Braid #4 Blue with Anti-Static Bobbin is a pre-fluxed copper braid that is used to remove solder which allows components to be replaced and excess solder to be removed
5% in range 100 pF to 1mF
simply slide the bottom shelf on the two posts at the desired height and connect the open end to the starter unit shelf using the "S" hooks - repeat for each shelf
INPLANT HANDLER, CELL SIZE 7-1/4 x 14-3/4 x 3/4 IN-5PK Metcal CV-H1-AV New AIM V9 No CleanShields ESD sensitive items from charges and electrostatic discharges (with lid in place) Protektive Pak shipping, handling, and storage containers Many sizes available for optimal fit of your product. Constructed of impregnated corrugated material for greater durability Static dissipative surface resistance of 1 x 106 to < 1 x 109 ohms per ANSI ESD STM11. 11 Buried shielding layer minimizes the potential of sloughing and abrasion contamination Easy
US$ 48.00
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