Hypertec S26361-F3870-L516-HY (Legacy) memory module 4 GB DDR2 800 MHz ECC 3200 Design Cooling type Heatsink Technical

Design Cooling type Heatsink Technical details Cooling type Heatsink Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC/server Memory form factor 240-pin DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC/server Memory form factor 240-pin DIMM Cooling type Heatsink ECC No Memory clock speed 1600 MHz Internal memory type DDR3

Memory Buffered memory type Unregistered (unbuffered) Internal memory 8 GB Memory form factor 240-pin DIMM CAS latency 10 ECC No Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Internal memory 8 GB Memory form factor 240-pin DIMM CAS latency 10 ECC No Memory clock speed 1600 MHz Internal memory type DDR3

35 V Memory Buffered memory type Registered (buffered) Internal memory 8 GB Memory form factor 240-pin DIMM CAS latency 9 Memory voltage 1

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Component for Laptop Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1066 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Component for Laptop Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1066 MHz Internal memory type DDR3

Hypertec S26361-F3870-L516-HY (Legacy) memory module 4 GB DDR2 800 MHz ECC 3200 Design Cooling type Heatsink TechnicalA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to