PRIMA-BOND™ (EG7655) 1 Ounce Kit (1/2 oz part A and part B) (Copy) Thermal Adhesives 7 W/m-ºC) and flexibility make

7 W/m-ºC) and flexibility make it excellent for bonding large area substrates

EG7655's high thermal conductivity (1

alumina to aluminum

PRIMA-BOND™ (EG7655) is a reworkable

PRIMA-BOND™ (EG7655) 1 Ounce Kit (1/2 oz part A and part B) (Copy) Thermal Adhesives 7 W/m-ºC) and flexibility makePRIMA BOND (EG7655) is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i. e., alumina to aluminum, silicon to copper). EG7655's high thermal conductivity (1. 7 W m C) and flexibility make it excellent for bonding large area substrates, components and heat sinks where thermal management is critical. This EG7655